Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515200 | Selective tungsten deposition within trench structures | Yufei Hu, He Ren, Yu Lei, Shi YOU, Kazuya Daito | 2022-11-29 |
| 11421322 | Blocker plate for use in a substrate process chamber | Xiaoxiong Yuan, Yu Lei, Kazuya Daito, Pingyan Lei, Dien-Yeh Wu +2 more | 2022-08-23 |
| 11417568 | Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill | Wei Lei, Yu Lei, Tae Hong Ha, Raymond Hung, Shirish A. PETHE | 2022-08-16 |
| 11404313 | Selective tungsten deposition at low temperatures | Yufei Hu, Yu Lei, Kazuya Daito, Da He, Jiajie Cen | 2022-08-02 |
| 11380536 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2022-07-05 |
| 11371117 | Process for multi-recycling, low-energy and high-purity extraction of lithium | — | 2022-06-28 |
| 11355391 | Method for forming a metal gapfill | Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more | 2022-06-07 |