Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11501969 | Direct extreme ultraviolet lithography on hard mask with reverse tone | Yongan Xu, Ekmini Anuja De Silva, Ashim Dutta, Chi-Chun Liu | 2022-11-15 |
| 11424367 | Wrap-around contacts including localized metal silicide | Eric R. Miller, Julien Frougier, Andrew M. Greene | 2022-08-23 |
| 11398377 | Bilayer hardmask for direct print lithography | Praveen Joseph, Gauri Karve | 2022-07-26 |
| 11398409 | Method of forming a BEOL interconnect structure using a subtractive metal via first process | Yongan Xu, Hsueh-Chung Chen | 2022-07-26 |
| 11328954 | Bi metal subtractive etch for trench and via formation | Chanro Park, Chih-Chao Yang, Injo Ok, Hsueh-Chung Chen | 2022-05-10 |
| 11316029 | Sacrificial fin for contact self-alignment | Indira Seshadri, Su Chen Fan, Christopher J. Waskiewicz, Eric R. Miller | 2022-04-26 |
| 11302571 | Cut integration for subtractive first metal line with bottom up second metal line | Somnath Ghosh, Hsueh-Chung Chen, Yongan Xu, Lawrence A. Clevenger | 2022-04-12 |
| 11302533 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yongan Xu | 2022-04-12 |
| 11264286 | Co-integration of tensile silicon and compressive silicon germanium | Nicolas Loubet, Pierre Morin | 2022-03-01 |
| 11239077 | Litho-etch-litho-etch with self-aligned blocks | Chi-Chun Liu, Nelson Felix, Ekmini Anuja De Silva, John C. Arnold, Allen H. Gabor | 2022-02-01 |