Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521935 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-10-18 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-07-26 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Prayudi Lianto, Guan Huei See | 2022-05-24 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Kyuil Cho, Han-Wen Chen, Chintan Buch +1 more | 2022-03-22 |
| 11264331 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2022-03-01 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-03-01 |