Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531056 | Predictive chip-maintenance | Irmgard Escher-Poeppel, Gerhard Poeppel | 2022-12-20 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss +3 more | 2022-11-29 |
| 11502042 | Processing of one or more carrier bodies and electronic components by multiple alignment | Thomas Behrens, Martin Gruber, Thorsten Scharf, Peter Strobel | 2022-11-15 |
| 11393742 | Method for fabricating a semiconductor flip-chip package | Irmgard Escher-Poeppel, Klaus Pressel, Bernd Rakow | 2022-07-19 |
| 11387533 | Semiconductor package with plastic waveguide | Maciej Wojnowski, Dirk Hammerschmidt, Walter Hartner, Johannes Lodermeyer, Chiara Mariotti | 2022-07-12 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2022-04-12 |
| 11264356 | Batch manufacture of packages by sheet separated into carriers after mounting of electronic components | Thomas Behrens, Andreas Grassmann, Martin Gruber, Thorsten Scharf | 2022-03-01 |
| 11250981 | Vertical inductor for WLCSP | Andreas Wolter, Gerhard Knoblinger | 2022-02-15 |