Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410906 | Semiconductor package and method for fabricating a semiconductor package | Juergen Hoegerl, Bernd Betz, Daniel Obermeier | 2022-08-09 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2022-04-12 |