Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515228 | Double sided semiconductor package | Ordwin Haase, Tobias Kist | 2022-11-29 |
| 11493538 | Sensor devices with sensor chip and busbar | Rainer Markus Schaller, Volker Strutz | 2022-11-08 |
| 11410906 | Semiconductor package and method for fabricating a semiconductor package | Bernd Betz, Stephan Bradl, Daniel Obermeier | 2022-08-09 |
| 11385301 | Sensor devices having a sensor chip and busbar | Rainer Markus Schaller, Volker Strutz | 2022-07-12 |
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg | 2022-05-03 |
| 11244886 | Package cooled with cooling fluid and comprising shielding layer | Andreas Grassmann, Wolfram Hable, Ivan Nikitin, Achim Strass | 2022-02-08 |
| 11217504 | Semiconductor package with passive electrical component and method for the production thereof | Ordwin Haase, Tobias Kist | 2022-01-04 |