Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437311 | Semiconductor module and method for producing the same | Peter Kanschat | 2022-09-06 |
| 11404336 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Martin Mayer, Ivan Nikitin | 2022-08-02 |
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Juergen Hoegerl, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg | 2022-05-03 |