Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450593 | Spacer frame for semiconductor packages | — | 2022-09-20 |
| 11404336 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Olaf Hohlfeld, Martin Mayer | 2022-08-02 |
| 11404392 | Molded semiconductor module for PCB embedding | — | 2022-08-02 |
| 11244886 | Package cooled with cooling fluid and comprising shielding layer | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Achim Strass | 2022-02-08 |