Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Magdalena Hoier | 2022-05-03 |
| 11233027 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2022-01-25 |