Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410906 | Semiconductor package and method for fabricating a semiconductor package | Juergen Hoegerl, Bernd Betz, Stephan Bradl | 2022-08-09 |
DO
Daniel Obermeier
Overall (2022): #480,449 of 548,613Top 90%
1
Patents 2022