Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410906 | Semiconductor package and method for fabricating a semiconductor package | Juergen Hoegerl, Stephan Bradl, Daniel Obermeier | 2022-08-09 |
BB
Bernd Betz
Overall (2022): #518,758 of 548,613Top 95%
1
Patents 2022