Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393742 | Method for fabricating a semiconductor flip-chip package | Thorsten Meyer, Irmgard Escher-Poeppel, Klaus Pressel | 2022-07-19 |
BR
Bernd Rakow
Overall (2022): #516,834 of 548,613Top 95%
1
Patents 2022