Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488887 | Thermal enablement of dies with impurity gettering | Gamal Refai-Ahmed, Boon Yong Ang, Toshiyuki Hisamura, Suresh Parameswaran, Scott McCann +1 more | 2022-11-01 |
| 11488936 | Stacked silicon package assembly having vertical thermal management | Gamal Refai-Ahmed, Jaspreet S. Gandhi, Cheang-Whang Chang | 2022-11-01 |
| 11476556 | Remote active cooling heat exchanger and antenna system with the same | Mohsen H. Mardi, Gamal Refai-Ahmed, Volker Aue | 2022-10-18 |
| 11373929 | Thermal heat spreader plate for electronic device | Gamal Refai-Ahmed, Chi-Yi Chao, Hoa Do, Anthony Torza, Brian D. Philofsky +1 more | 2022-06-28 |
| 11373989 | Package integration for laterally mounted IC dies with dissimilar solder interconnects | Jaspreet S. Gandhi | 2022-06-28 |
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Tien-Yu Lee +1 more | 2022-06-07 |
| 11330738 | Force balanced package mounting | Gamal Refai-Ahmed, Chi-Yi Chao, Huayan Wang, Volker Aue | 2022-05-10 |
| 11328976 | Three-dimensional thermal management apparatuses for electronic devices | Gamal Refai-Ahmed, Chi-Yi Chao, Hoa Do, Anthony Torza, Brian D. Philofsky | 2022-05-10 |
| 11315858 | Chip package assembly with enhanced solder resist crack resistance | Yu-Hsiang Sun, Tien-Yu Lee, Jaspreet S. Gandhi | 2022-04-26 |
| 11302674 | Modular stacked silicon package assembly | Jaspreet S. Gandhi, William E. Allaire, Hong Shi, Kerry M. Pierce | 2022-04-12 |
| 11282775 | Chip package assembly with stress decoupled interconnect layer | Jaspreet S. Gandhi | 2022-03-22 |
| 11246211 | Micro device with through PCB cooling | Gamal Refai-Ahmed, Nagadeven Karunakaran, Hoa Do | 2022-02-08 |
| 11217550 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi | 2022-01-04 |