Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527484 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2022-12-13 |
| 11322444 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more | 2022-05-03 |