Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521793 | Resonant LC tank package and method of manufacture | Saravana Maruthamuthu, Andreas Augustin | 2022-12-06 |
| 11469213 | Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics | Georg Seidemann, Thomas Wagner, Klaus Reingruber, Bernd Waidhas | 2022-10-11 |
| 11410908 | Integrated circuit devices with front-end metal structures | Reinhard Mahnkopf, Sonja Koller | 2022-08-09 |
| 11374323 | Patch antennas stitched to systems in packages and methods of assembling same | Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Stephan Stoeckl +2 more | 2022-06-28 |
| 11270941 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Georg Seidemann, Thomas Wagner, Bernd Waidhas | 2022-03-08 |
| 11250981 | Vertical inductor for WLCSP | Thorsten Meyer, Gerhard Knoblinger | 2022-02-15 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Marc Dittes +1 more | 2022-02-01 |