Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508617 | Method of forming interconnect for semiconductor device | Hao Jiang, Chi-Pin Lu, He Ren, Chi-I Lang, Ho-yung David Hwang | 2022-11-22 |
| 11410885 | Fully aligned subtractive processes and electronic devices therefrom | He Ren, Hao Jiang | 2022-08-09 |
| 11380536 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2022-07-05 |
| 11373903 | Doped selective metal caps to improve copper electromigration with ruthenium liner | Zhiyuan Wu | 2022-06-28 |
| 11289342 | Damage free metal conductor formation | He Ren, Jong Mun Kim, Maximillian Clemons, Minrui Yu, Chentsau Chris Ying | 2022-03-29 |
| 11257677 | Methods and devices for subtractive self-alignment | He Ren, Hao Jiang, Wenting Hou, Jianxin Lei, Chen Gong +1 more | 2022-02-22 |