Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508617 | Method of forming interconnect for semiconductor device | Hao Jiang, Chi-Pin Lu, He Ren, Ho-yung David Hwang, Mehul Naik | 2022-11-22 |
| 11495461 | Film stack for lithography applications | Tejinder Singh, Suketu Arun Parikh, Daniel Lee Diehl, Michael Stolfi, Jothilingam Ramalingam +3 more | 2022-11-08 |
| 11437238 | Patterning scheme to improve EUV resist and hard mask selectivity | Nancy Fung, Ho-yung David Hwang | 2022-09-06 |