Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508617 | Method of forming interconnect for semiconductor device | Hao Jiang, He Ren, Chi-I Lang, Ho-yung David Hwang, Mehul Naik | 2022-11-22 |
CL
Chi-Pin Lu
Overall (2022): #497,214 of 548,613Top 95%
1
Patents 2022