Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488892 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Roger D. St. Amand, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2022-11-01 |
| 11488934 | Semiconductor package and manufacturing method thereof | Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2022-11-01 |
| 11430723 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2022-08-30 |
| 11358114 | Continuous tubular reactor and method of operating the same | Changyeon Baek, Won Sik Jung, Hyojin Kim, Gahee Hyun | 2022-06-14 |
| 11355449 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Jae Ung Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh +4 more | 2022-06-07 |
| 11233246 | Electrode including metal nanoparticles having conductive polymer shell and conductive film and method for manufacturing the same | You Jung Song, Hong Seok Yun, Bum Joon Kim, Young Kwon Kim | 2022-01-25 |