Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488934 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Robert Lanzone, Jae Ung Lee +2 more | 2022-11-01 |
| 11434319 | Method of preparing high solids content polymer polyols having low viscosity | Seul Gi Kim, Seung Moo Huh, Jin-Woo Park | 2022-09-06 |
| 11355449 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Jae Ung Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh +4 more | 2022-06-07 |