Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508635 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2022-11-22 |
| 11355449 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Jae Ung Lee, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim +4 more | 2022-06-07 |
| 11355470 | Semiconductor device and methods of manufacturing semiconductor devices | Ji Yeon Ryu, Jae Beom Shim, Tae Yong Lee | 2022-06-07 |