Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488934 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2022-11-01 |
| 11355449 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim +4 more | 2022-06-07 |