Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508635 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2022-11-22 |
| 11495505 | Semiconductor devices and related methods | Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +10 more | 2022-11-08 |
| 11398455 | Semiconductor devices and related methods | Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +8 more | 2022-07-26 |