Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488892 | Methods and structures for increasing the allowable die size in TMV packages | Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2022-11-01 |
| 11362027 | Semiconductor devices and methods of manufacturing semiconductor devices | Roger D. St. Amand | 2022-06-14 |