Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488892 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang | 2022-11-01 |
| 11244835 | Control of under-fill using a film during fabrication for a dual-sided ball grid array package | Howard E. Chen, Hoang Mong Nguyen | 2022-02-08 |
| 11233014 | Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same | Howard E. Chen, David Viveiros, Jr., Russ Alan Reisner | 2022-01-25 |