Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488892 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Sung Jin Yang, Robert Francis Darveaux | 2022-11-01 |
| 11430723 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho +4 more | 2022-08-30 |