Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201281 | Method for forming a flat bottom electrode via (BEVA) top surface for memory | Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Sheng-Hung Shih, Tung-Sheng Hsiao +3 more | 2021-12-14 |
| 11094545 | Self-aligned insulated film for high-K metal gate device | Jin-Aun Ng, Bao-Ru Young, Harry-Hak-Lay Chuang, Maxi Chang, Chih-Tang Peng +8 more | 2021-08-17 |
| 11094744 | Interconnect landing method for RRAM technology | Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Kuo-Chi Tu, Wen-Ting Chu +1 more | 2021-08-17 |
| 11038108 | Step height mitigation in resistive random access memory structures | Wei-Ming Wang, Chia-Wei Liu, Wen-Ting Chu, Yu-Wen Liao, Huei-Tzu Wang | 2021-06-15 |
| 11004975 | Semiconductor device and manufacturing method thereof | Kuo-Chi Tu, Sheng-Hung Shih, Tong-Chern Ong, Wen-Ting Chu | 2021-05-11 |
| 10903274 | Interconnect landing method for RRAM technology | Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Kuo-Chi Tu, Wen-Ting Chu +1 more | 2021-01-26 |