Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201281 | Method for forming a flat bottom electrode via (BEVA) top surface for memory | Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih, Tung-Sheng Hsiao +3 more | 2021-12-14 |
| 11094744 | Interconnect landing method for RRAM technology | Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Kuo-Chi Tu, Wen-Ting Chu +1 more | 2021-08-17 |
| 11037989 | Method to form memory cells separated by a void-free dielectric structure | Wen-Ting Chu, Yu-Wen Liao | 2021-06-15 |
| 11037990 | Method to form memory cells separated by a void-free dielectric structure | Wen-Ting Chu, Yu-Wen Liao | 2021-06-15 |
| 10910260 | Method for manufacturing semiconductor device | Wei-Chieh Huang, Chin-Wei Liang, Feng-Jia Shiu, Jieh-Jang Chen, Ching-Sen Kuo | 2021-02-02 |
| 10903274 | Interconnect landing method for RRAM technology | Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Kuo-Chi Tu, Wen-Ting Chu +1 more | 2021-01-26 |