Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201190 | RRAM memory cell with multiple filaments | Chin-Chieh Yang, Wen-Ting Chu, Yu-Wen Liao | 2021-12-14 |
| 11201281 | Method for forming a flat bottom electrode via (BEVA) top surface for memory | Hsia-Wei Chen, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih, Tung-Sheng Hsiao +3 more | 2021-12-14 |
| 11094744 | Interconnect landing method for RRAM technology | Hsia-Wei Chen, Chin-Chieh Yang, Jen-Sheng Yang, Kuo-Chi Tu, Wen-Ting Chu +1 more | 2021-08-17 |
| 10903274 | Interconnect landing method for RRAM technology | Hsia-Wei Chen, Chin-Chieh Yang, Jen-Sheng Yang, Kuo-Chi Tu, Wen-Ting Chu +1 more | 2021-01-26 |