Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11047059 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Aaron Berke, Bryan L. Buckalew | 2021-06-29 |
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, Aaron Berke, James Isaac Fortner, Justin Oberst +1 more | 2021-05-11 |
| 10989747 | Apparatus for measuring condition of electroplating cell components and associated methods | Mark E. Emerson, Lawrence Ossowski | 2021-04-27 |
| 10982346 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Aaron Berke, Robert Rash, Santosh Kumar, Lee Peng Chua | 2021-04-20 |
| 10954605 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, David W. Porter, Thomas A. Ponnuswamy | 2021-03-23 |
| 10920335 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2021-02-16 |
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Robert Rash | 2021-02-16 |