Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11047059 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Bryan L. Buckalew, Steven T. Mayer | 2021-06-29 | $192,135,000 |
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, James Isaac Fortner, Justin Oberst, Steven T. Mayer +1 more | 2021-05-11 | $387,584,000 |
| 10982346 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Robert Rash, Steven T. Mayer, Santosh Kumar, Lee Peng Chua | 2021-04-20 | $284,078,000 |
| 10969036 | High flow multi-way piston valve for deposition systems | James Isaac Fortner, Robert Rash, Jingbin Feng | 2021-04-06 | $236,818,000 |
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Robert Rash, Steven T. Mayer | 2021-02-16 | $170,085,000 |