| 11047059 |
Dynamic modulation of cross flow manifold during elecroplating |
Kari Thorkelsson, Bryan L. Buckalew, Steven T. Mayer |
2021-06-29 |
| 11001934 |
Methods and apparatus for flow isolation and focusing during electroplating |
Stephen J. Banik, II, Bryan L. Buckalew, James Isaac Fortner, Justin Oberst, Steven T. Mayer +1 more |
2021-05-11 |
| 10982346 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
Robert Rash, Steven T. Mayer, Santosh Kumar, Lee Peng Chua |
2021-04-20 |
| 10969036 |
High flow multi-way piston valve for deposition systems |
James Isaac Fortner, Robert Rash, Jingbin Feng |
2021-04-06 |
| 10923340 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Robert Rash, Steven T. Mayer |
2021-02-16 |
