Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Robert Rash, Steven T. Mayer | 2021-02-16 |