BB

Bryan L. Buckalew

Lam Research: 6 patents #4 of 349Top 2%
NS Novellus Systems: 2 patents #1 of 26Top 4%
Overall (2021): #13,860 of 548,734Top 3%
8
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11168407 Copper electrodeposition on cobalt lined features Jeyavel Velmurugan, Thomas A. Ponnuswamy 2021-11-09
11047059 Dynamic modulation of cross flow manifold during elecroplating Kari Thorkelsson, Aaron Berke, Steven T. Mayer 2021-06-29
11001934 Methods and apparatus for flow isolation and focusing during electroplating Stephen J. Banik, II, Aaron Berke, James Isaac Fortner, Justin Oberst, Steven T. Mayer +1 more 2021-05-11
10968531 Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill 2021-04-06
10954604 Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes 2021-03-23
10930511 Copper electrodeposition sequence for the filling of cobalt lined features Jeyavel Velmurugan, Thomas A. Ponnuswamy 2021-02-23
10920335 Electroplating apparatus for tailored uniformity profile Steven T. Mayer, David W. Porter, Robert Rash 2021-02-16
10923340 Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity Burhanuddin Kagajwala, Lee Peng Chua, Aaron Berke, Robert Rash, Steven T. Mayer 2021-02-16