| 11001934 |
Methods and apparatus for flow isolation and focusing during electroplating |
Stephen J. Banik, II, Bryan L. Buckalew, Aaron Berke, James Isaac Fortner, Justin Oberst +1 more |
2021-05-11 |
| 10982346 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
Aaron Berke, Steven T. Mayer, Santosh Kumar, Lee Peng Chua |
2021-04-20 |
| 10975489 |
One-piece anode for tuning electroplating at an edge of a substrate |
James Isaac Fortner |
2021-04-13 |
| 10969036 |
High flow multi-way piston valve for deposition systems |
James Isaac Fortner, Aaron Berke, Jingbin Feng |
2021-04-06 |
| 10920335 |
Electroplating apparatus for tailored uniformity profile |
Steven T. Mayer, David W. Porter, Bryan L. Buckalew |
2021-02-16 |
| 10923340 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Steven T. Mayer |
2021-02-16 |
