Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, Aaron Berke, James Isaac Fortner, Justin Oberst +1 more | 2021-05-11 |
| 10982346 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Aaron Berke, Steven T. Mayer, Santosh Kumar, Lee Peng Chua | 2021-04-20 |
| 10975489 | One-piece anode for tuning electroplating at an edge of a substrate | James Isaac Fortner | 2021-04-13 |
| 10969036 | High flow multi-way piston valve for deposition systems | James Isaac Fortner, Aaron Berke, Jingbin Feng | 2021-04-06 |
| 10920335 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Bryan L. Buckalew | 2021-02-16 |
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Steven T. Mayer | 2021-02-16 |