Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133259 | Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network | Joshua M. Rubin, Arvind Kumar, Lawrence A. Clevenger, Steven L. Wright, Wiren D. Becker | 2021-09-28 |
| 11015913 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Katsuyuki Sakuma | 2021-05-25 |
| 10964881 | Piezoelectronic device with novel force amplification | Bruce G. Elmegreen, Marcelo A. Kuroda, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon | 2021-03-30 |
| 10957657 | Advanced crack stop structure | Chih-Chao Yang, Baozhen Li, Griselda Bonilla | 2021-03-23 |