| 11189580 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Krishna Bharath, Feras Eid, Johanna M. Swan, Aleksandar Aleksov |
2021-11-30 |
| 11147197 |
Microelectronic package electrostatic discharge (ESD) protection |
Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid |
2021-10-12 |
| 11133263 |
High-density interconnects for integrated circuit packages |
Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff |
2021-09-28 |
| 11101205 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings |
2021-08-24 |
| 11049791 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Jimin Yao |
2021-06-29 |
| 11004618 |
Capacitor with electrodes made of an interconnected corrugated carbon-based network |
Maher F. El-Kady, Richard B. Kaner |
2021-05-11 |
| 10998272 |
Organic interposers for integrated circuit packages |
Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Johanna M. Swan |
2021-05-04 |
