Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171066 | Semiconductor panels, semiconductor packages, and methods for manufacturing thereof | Andreas Grassmann | 2021-11-09 |
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Chan Lam Cha, Wei Han Koo, Klaus Schiess, Guan Choon Matthew Nelson Tee | 2021-08-03 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz +1 more | 2021-03-30 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner +2 more | 2021-02-09 |
| 10903166 | Integrated circuit packages | Sanka Ganesan, Gerald Ofner | 2021-01-26 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber +2 more | 2021-01-05 |