Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195780 | Stacked silicon package assembly having thermal management using phase change material | Gamal Refai-Ahmed, Suresh Ramalingam | 2021-12-07 |
| 11145566 | Stacked silicon package assembly having thermal management | Gamal Refai-Ahmed, Suresh Ramalingam, Cheang-Whang Chang | 2021-10-12 |
| 11139258 | Bonding pads with thermal pathways | James M. Derderian, Sameer S. Vadhavkar, Jian Li | 2021-10-05 |
| 11127643 | Test structures for validating package fabrication process | Vadim Heyfitch | 2021-09-21 |
| 11114360 | Multi-die device structures and methods | Myongseob Kim | 2021-09-07 |
| 10971474 | Package integration for high bandwidth memory | Henley Liu | 2021-04-06 |
| 10930611 | Solder joints for board level reliability | Tien-Yu Lee | 2021-02-23 |
| 10916487 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Xiao Li | 2021-02-09 |
| 10886196 | Semiconductor devices having conductive vias and methods of forming the same | — | 2021-01-05 |