Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195780 | Stacked silicon package assembly having thermal management using phase change material | Jaspreet S. Gandhi, Suresh Ramalingam | 2021-12-07 |
| 11145566 | Stacked silicon package assembly having thermal management | Suresh Ramalingam, Jaspreet S. Gandhi, Cheang-Whang Chang | 2021-10-12 |