Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11195780 | Stacked silicon package assembly having thermal management using phase change material | Jaspreet S. Gandhi, Gamal Refai-Ahmed | 2021-12-07 | $68,705,000 |
| 11145566 | Stacked silicon package assembly having thermal management | Gamal Refai-Ahmed, Jaspreet S. Gandhi, Cheang-Whang Chang | 2021-10-12 | $67,682,000 |
| 11107770 | Integrated electrical/optical interface with two-tiered packaging | Kun-Yung Chang, Yohan Frans, Chuan Xie, Mayank Raj | 2021-08-31 | $32,901,000 |
| 11043484 | Method and apparatus of package enabled ESD protection | Hong Shi, James Karp, Siow Chek Tan, Martin L. Voogel, Mohsen H. Mardi +1 more | 2021-06-22 | $31,440,000 |