{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2021", "item": "https://www.patentleaderboard.com/2021/"}, {"@type": "ListItem", "position": 3, "name": "AMD", "item": "https://www.patentleaderboard.com/2021/company/amd"}, {"@type": "ListItem", "position": 4, "name": "Hong Shi", "item": "https://www.patentleaderboard.com/2021/inventor/fl:ho_ln:shi-44"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
HS

Hong Shi — 1 Patent in 2021

AMD: 1 patents #373 of 890Top 45%
Los Gatos, CA: #271 of 619 inventorsTop 45%
California: #26,007 of 66,859 inventorsTop 40%
Overall (2021): #430,395 of 548,734Top 80%
1 Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11043484 Method and apparatus of package enabled ESD protection James Karp, Siow Chek Tan, Martin L. Voogel, Mohsen H. Mardi, Suresh Ramalingam +1 more 2021-06-22 $31,440,000