Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked silicon package assembly having thermal management

Stacked silicon package assembly having thermal management

US Patent 11145566 · Granted Oct 12, 2021

Estimated economic value: $67,682,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device with below PCB thermal management2025
Frame for coupling of a thermal management device to a printed circuit board2025
Frame for coupling of a thermal management device to a printed circuit board2025
Heat spreader for a semiconductor package2025
Heat spreader for a semiconductor package2025
Chip package with near-die integrated passive device2024
Semiconductor chip with redundant thru-silicon-vias2024
Integrated circuit (IC) structure protection scheme2024
Single event upset tolerant memory device2024
Thermal pads between stacked semiconductor dies and associated systems and metho2024
Fanout integration for stacked silicon package assembly2024
Fanout integration for stacked silicon package assembly2024