Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205639 | Integrated circuit device with stacked dies having mirrored circuitry | Myongseob Kim, Cheang-Whang Chang | 2021-12-21 |
| 11114344 | IC die with dummy structures | Hui-Wen Lin, Nui Chong, Myongseob Kim, Ping-Chin Yeh, Cheang-Whang Chang | 2021-09-07 |
| 11054461 | Test circuits for testing a die stack | Nui Chong, Amitava Majumdar, Cheang-Whang Chang, Myongseob Kim, Albert Shih-Huai Lin | 2021-07-06 |
| 10971474 | Package integration for high bandwidth memory | Jaspreet S. Gandhi | 2021-04-06 |