Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164749 | Warpage reduction | Nui Chong | 2021-11-02 |
| 11119146 | Testing of bonded wafers and structures for testing bonded wafers | Nui Chong, Yan Wang | 2021-09-14 |
| 11114344 | IC die with dummy structures | Nui Chong, Myongseob Kim, Henley Liu, Ping-Chin Yeh, Cheang-Whang Chang | 2021-09-07 |
| 11094545 | Self-aligned insulated film for high-K metal gate device | Jin-Aun Ng, Bao-Ru Young, Harry-Hak-Lay Chuang, Maxi Chang, Chih-Tang Peng +8 more | 2021-08-17 |