Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164749 | Warpage reduction | Hui-Wen Lin | 2021-11-02 |
| 11119146 | Testing of bonded wafers and structures for testing bonded wafers | Yan Wang, Hui-Wen Lin | 2021-09-14 |
| 11114344 | IC die with dummy structures | Hui-Wen Lin, Myongseob Kim, Henley Liu, Ping-Chin Yeh, Cheang-Whang Chang | 2021-09-07 |
| 11054461 | Test circuits for testing a die stack | Amitava Majumdar, Cheang-Whang Chang, Henley Liu, Myongseob Kim, Albert Shih-Huai Lin | 2021-07-06 |