Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package integration for high bandwidth memory

Package integration for high bandwidth memory

US Patent 10971474 · Granted Apr 6, 2021

Estimated economic value: $69,722,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit (IC) structure protection scheme2024
Thermal pads between stacked semiconductor dies and associated systems and metho2024
Fanout integration for stacked silicon package assembly2024
Universal interposer for a semiconductor package2024
Interwafer connection structure for coupling wafers in a wafer stack2024
Methods of manufacturing stacked semiconductor die assemblies with high efficien2023
Semiconductor device assembly with through-mold cooling channel formed in encaps2023
Stacked semiconductor die assemblies with multiple thermal paths and associated 2023
Stacked silicon package assembly having vertical thermal management2022
Package integration for laterally mounted IC dies with dissimilar solder interco2022
Stacked silicon package assembly having thermal management2022
Stacked silicon package assembly having thermal management2022