Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11139258 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2021-10-05 | $16,233,000 |
| 11081460 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Owen R. Fay, Adriel Jebin Jacob Jebaraj, Wayne H. Huang | 2021-08-03 | $20,873,000 |
| 10957625 | Pillar-last methods for forming semiconductor devices | Anilkumar Chandolu, Wayne H. Huang | 2021-03-23 | $19,320,000 |
| 10916527 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2021-02-09 | $22,943,000 |
| 10886244 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Wayne H. Huang, Anilkumar Chandolu, Mark Bossier | 2021-01-05 | $21,674,000 |