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Millimeter wave antenna and EMI shielding integrated with fan-out package |
— |
2021-12-07 |
| 11177222 |
Semiconductor packages and associated methods with antennas and EMI isolation shields |
Dong Soon Lim, Randon K. Richards, Aparna U. Limaye |
2021-11-16 |
| 11171118 |
Semiconductor assemblies including thermal circuits and methods of manufacturing the same |
Chan H. Yoo, Eiichi Nakano |
2021-11-09 |
| 11139229 |
Package-on-package semiconductor assemblies and methods of manufacturing the same |
Jack E. Murray |
2021-10-05 |
| 11139262 |
Use of pre-channeled materials for anisotropic conductors |
Mark E. Tuttle, John F. Kaeding, Eiichi Nakano, Shijian Luo |
2021-10-05 |
| 11088114 |
High density pillar interconnect conversion with stack to substrate connection |
Kyle K. Kirby, Akshay N. Singh |
2021-08-10 |
| 11081783 |
Integrated antenna using through silicon vias |
— |
2021-08-03 |
| 11081460 |
Methods and systems for manufacturing pillar structures on semiconductor devices |
Suresh Yeruva, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj, Wayne H. Huang |
2021-08-03 |
| 11018098 |
Fabricated two-sided millimeter wave antenna using through-silicon-vias |
John F. Kaeding |
2021-05-25 |
| 11018056 |
Encapsulated solder TSV insertion interconnect |
Kyle K. Kirby |
2021-05-25 |
| 10998271 |
High density pillar interconnect conversion with stack to substrate connection |
Kyle K. Kirby, Akshay N. Singh |
2021-05-04 |
| 10950565 |
Interconnect structures for preventing solder bridging, and associated systems and methods |
Kyle S. Mayer |
2021-03-16 |
| 10943794 |
Semiconductor device assembly with pillar array and test ability |
Akshay N. Singh, Kyle K. Kirby |
2021-03-09 |
