Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094670 | Semiconductor device assemblies including multiple shingled stacks of semiconductor dies | Hong Wan Ng | 2021-08-17 |
| 11088114 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Kyle K. Kirby | 2021-08-10 |
| 10998271 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Kyle K. Kirby | 2021-05-04 |
| 10943794 | Semiconductor device assembly with pillar array and test ability | Owen R. Fay, Kyle K. Kirby | 2021-03-09 |