Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10952333 | Method for stress reduction in semiconductor package via carrier | Benjamin L. McClain | 2021-03-16 |
| 10916487 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Jaspreet S. Gandhi | 2021-02-09 |
| 10916527 | Apparatuses and methods for semiconductor die heat dissipation | Sameer S. Vadhavkar, Anilkumar Chandolu | 2021-02-09 |